Positive-type photosensitive resin composition and cured film prepared therefrom
US11106133B2 · kind B2 · utility
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1References
9Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 15, 2018 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Aug 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises an acrylic resin and a siloxane copolymer containing a sulfonated diazoquinone group at the terminal thereof. Thus, the film retention rate and adhesiveness can be further enhanced, while the sensitivity is maintained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.