Heat dissipation using airflow diversion with cooling fins
US11106256B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2018 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Jan 12, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein may include apparatuses, systems and/or processes to provide cooling to a heat source. In embodiments, a first set of cooling fins are thermally coupled to a heat source in a first orientation to allow first airflow to pass through in between the first set of cooling fins to dissipate heat from the heat source. A second set of cooling fins thermally coupled to the heat source in a second orientation to allow second airflow to pass through in between the second set of cooling fins to dissipate heat from the heat source. A barrier may be coupled to the second set of cooling fins to substantially divert the second airflow away from the first airflow about to pass through in between the first set of cooling fins so that pre-heated air does not flow over the first set of cooling fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.