Thin-plate substrate holding finger and transfer robot provided with said finger
US11107722B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 23, 2018 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Jun 25, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is holding finger 21 with which a thin-plate substrate W that has been subjected to surface processing can be transferred without generating a natural oxide film on a surface to be processed of the thin-plate substrate W. The holding finger 21 comprises: a finger body 47 which is internally formed with a flow path for circulating an inert gas; a pipe member which provides communication between an inert gas supply source and the flow path; an ejection port for ejecting the inert gas onto the surface to be processed of the thin-plate substrate W, the ejection port communicating with the flow path and being disposed on a surface of the finger body 47 opposing the surface to be processed of the thin-plate substrate W; an abutting member 49 which is disposed on the surface of the finger body 47 on which the ejection port is formed, and which abuts a peripheral portion of the thin-plate substrate W; a clamp member 57 which is disposed to be movable forward and backward with respect to the thin-plate substrate W; and a clamp mechanism for the clamp member 57 forward and backward.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.