Ultrasonic sensing device
US11107858B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2019 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Oct 28, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/106
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.