Method and device for transporting an arrangement of flexible circuit substrates during the production of a laminate therefrom
US11107943B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2019 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Feb 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method and a device for transporting an arrangement of flexible circuit substrates produced on a transport substrate during the production of a laminate from the arranged circuit substrates, as well as—building thereon—a method and a device for producing a laminate of flexible circuit substrates. In the method, a film is applied to the arranged circuit substrates on the side thereof opposite the transport substrate, with the result that the film comes to lie over the transport substrate in at least two sections that are separate from each other and are not covered by a circuit substrate, and runs between them continuously over at least one of the circuit substrates. Then, the arranged circuit substrates are fixed on the transport substrate by means of the generation of a negative pressure acting on the arrangement of the circuit substrates, and which, at least in sections, directly impinges on the arrangement of the circuit substrates itself as well as, at least in sections, additionally on the film (6) and thereby in turn indirectly on at least one of the circuit substrates in the direction of the transport substrate with a pressing force with respect to…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.