Component with end-side mounted light emitting semiconductor chip

US11107945B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Alexander Linkov · Regensburg, DE
• Frank Singer · Regenstauf, DE
• Matthias Bruckschloegl · Regensburg, DE
• Siegfried Herrmann · Neukirchen, DE
• Jürgen Moosburger · Regensburg, DE
• Thomas Schwarz · Rhede, DE

Key dates

• Filing date: Nov 22, 2017
• Grant date: Aug 31, 2021
• Expiry date: Jan 22, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A component includes a light emitting semiconductor chip, wherein the semiconductor chip includes a layer arrangement including a plurality of layers, the p-conducting layer and the n-conducting layer adjoin one another in an active zone, a first electrical contact is configured on the p-conducting side of the layer arrangement at a first side of the semiconductor chip, a second electrical contact is configured on the n-conducting side of the layer arrangement at a second side of the semiconductor chip, the second side being situated opposite the first side of the semiconductor chip, the first side of the semiconductor chip transitions into the second side via an end side, the semiconductor chip is secured by the end side on a substrate, the substrate includes a first and second further electrical contact, and the further electrical contacts electrically conductively connect to the electrical contacts of the semiconductor chip.