Printed metal gasket
US11108027B2 · kind B2 · utility
1Cited by
22References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2019 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Dec 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/821
Abstract
Techniques and devices are provided for attaching a die to a metal manifold. A metal-containing ink is used to deposit a metal trace on the die and thereby to form a gasket, after which the die is compressed against the manifold to form a sealed connection between the two.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.