System for additive manufacturing using thin-film material
US11109453B2 · kind B2 · utility
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20Claims
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Assignee
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Key dates
| Filing date | Feb 15, 2018 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Dec 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/014
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system is disclosed for additively manufacturing a structure. The system may include a feeder configured to feed a thin-film material through the system, and a cutter configured to cut out of the thin-film material a pattern associated with a shape of the structure at a particular layer within the structure. The system may also include a placer configured to place the pattern in at least one of a desired location and a desired orientation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.