Ultrasonic bonding machine
US11110541B2 · kind B2 · utility
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2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2017 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | May 28, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Two aluminum alloy plates are sandwiched between an anvil and a chip of a horn which is being vibrated by a vibration unit, to perform ultrasonic bonding. A deposit removing unit is provided above the horn. When the horn is vibrated by the vibration unit and raised by an elevator, the chip positioned on the top of the horn comes into contact with a removal section, with the chip being vibrated, to allow the removal section to remove a deposit adhering to the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.