Patent · US Active

Laser cutting and removal of contoured shapes from transparent substrates

US11111170B2 · kind B2 · utility

1Cited by

130References

25Claims

0Family size

Assignee

CORNING INCORPORATED · US

Inventors

Bradley Frederick Bowden · Edison, US
Xiaoju Guo · Corning, US
Thomas Hackert · Germering, DE
Garrett Andrew Piech · Corning, US
Kristopher Allen Wieland · Corning, US

Key dates

Filing date	May 4, 2017
Grant date	Sep 7, 2021
Priority date	—
Expiry date	Sep 19, 2037

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P40/57
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.