Resin compositions and resin infusion process
US11111333B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Oct 24, 2018 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Oct 24, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L9/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aromatic amine curing agent, and (c) core-shell rubber particles. In another embodiment, the resin composition (a) at least two polyepoxides, one of which is diglycidyl ether of bis(hydroxyphenyl)fluorene, (b) an aromatic amine curing agent, and (c) core-shell rubber particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.