Microtransfer molding process and patterned substrate obtainable therefrom
US11112692B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jun 8, 2018 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Jun 8, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Microtransfer molding process and patterned substrate obtainable therefrom The present invention pertains to the field of nanoimprint lithography (NIL) processes and more specifically to a MicroTransfer Molding process used for providing a sol-gel patterned layer on a substrate without any residual layer. The process comprises the following successive steps: (a) impregnating a soft mold with a sol-gel layer coated on a first substrate, under conditions of a relative solvent pressure adjusted such that the layer swells by vapor absorption between 10 and 60% vol., so as to fill the mold under the action of capillary forces, (b) removing the first substrate, (c) if needed, equilibrating the gel within the mold cavities, under a relative solvent pressure between 0 and 95%, in order to allow it to swell, (d) applying the swollen gel onto a second substrate to be patterned, (e) thermally treating this assembly so as to rigidify the gel, (f) removing the mold, and (g) curing the gel into a ceramic, thus forming a patterned substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.