Electronics chassis with oscillating heat pipe (OHP)
US11112840B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2019 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Aug 22, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/0275
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.