Plural heat-sink layers for an On-Wafer Laser of a heat-assisted magnetic recording device
US11114120B2 · kind B2 · utility
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27References
20Claims
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Key dates
| Filing date | Dec 3, 2020 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Dec 3, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a substrate and a reader deposited on the substrate. A laser is formed on a non-self supporting structure and bonded to the substrate. A plurality of heat sink layers are deposited between the reader and the laser and configured to provide thermal coupling between the substrate and the laser and sink heat away from the laser. A waveguide is deposited proximate the laser. The waveguide is configured to communicate light from the laser to a near-field transducer that directs energy resulting from plasmonic excitation to a recording medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.