Multilayer electronic component
US11114240B2 · kind B2 · utility
0Cited by
8References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 21, 2019 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Jan 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.