Element sub-structure
US11114266B1 · kind B1 · utility
0Cited by
1References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2020 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Mar 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R4/58
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sub-structure element support system is disclosed. The sub-structure element support system includes a novel molded structure designed to support an electrical element, such as a fuse. The molded structure is a protective and insulative sleeve for the electrical element and reduces forces on the electrical element during free-fall and operation conditions. The molded structure also facilitates automation during manufacturing and reduces cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.