Electronics assemblies and methods of manufacturing electronics assemblies with improved thermal performance
US11114361B2 · kind B2 · utility
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2References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 7, 2019 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Aug 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.