Electronic package arrangements and related methods
US11114363B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2019 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Sep 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/66
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic package arrangements and related methods are disclosed that provide one or more of improved thermal management and electromagnetic shielding. Electronic packages are disclosed that include arrangements of one or more electronic devices, overmold bodies, and heat spreaders or metal frame structures. The heat spreaders or metal frame structures may be arranged over the electronic devices to form heat dissipation paths that draw operating heat away from the electronic devices in one or more directions including above and below the electronic packages. The heat spreaders or metal frame structures may also be arranged to form electromagnetic shields that reduce crosstalk between the electronic devices within the electronic packages and to suppress unwanted emissions from either escaping or entering the electronic packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.