Array substrate and manufacturing method thereof

US11114477B2 · kind B2 · utility

Assignee

• WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.

Inventors

• Caiqin Chen · 红钢城街道, CN
• Xing Ming · 红钢城街道, CN

Key dates

• Filing date: Aug 23, 2018
• Grant date: Sep 7, 2021
• Expiry date: Jan 22, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K2102/311

Abstract

In a method for manufacturing an array substrate, a first photoresist pattern is formed on a buffer layer of a non-display region and the buffer layer uncovered by the first photoresist pattern is removed to form a first via hole in the non-display region. A second via hole is formed on the basis of the first via hole. The second via hole is connected to the first via hole. By forming the first via hole in the non-display region and forming the second via hole on the basis of the first via hole, completeness of film layers is ensured and product yield is improved.