Optoelectronic module assembly and manufacturing method
US11114573B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2019 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Dec 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/85
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.