Optoelectronic modules and optoelectronic molding tools and processes for manufacturing the same

US11114593B2 · kind B2 · utility

Assignee

• AMS SENSORS SINGAPORE PTE. LTD. · SG

Inventors

• Robert Lenart · Olmsted Falls, US
• Sonja Gantner · Lachen, CH
• Oezkan Ahishali · Lübben (Spreewald) - Lubin (Błota), DE

Key dates

• Filing date: Nov 30, 2017
• Grant date: Sep 7, 2021
• Expiry date: Nov 30, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0362

Abstract

This disclosure describes optoelectronic modules, methods for manufacturing pluralities of discrete optoelectronic modules, and optoelectronic molding tools. The methods include coating a substrate wafer and a plurality of optoelectronic components with a photosensitive material, and further include exposing select portions of the photosensitive material to electromagnetic radiation. The exposed portions delineate at least in part the dimensions of the optical channels, wherein the optical channels are associated with at least one optoelectronic component. In some instances, optical elements are incorporated into the optical channels. In some instances, the exposed portions are the optical channels. In some instances, the exposed portions are spacers between the optical channels.