Organic layer and method of manufacturing the same, directional heat source assembly, and display panel
US11114618B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 12, 2019 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Aug 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/351
Abstract
In one embodiment, there is provided a method of manufacturing an organic layer. The method includes: forming an organic material solution layer on a substrate; and heating, by a directional heat source assembly, at least a first portion of organic material solution of the organic material solution layer that is inside a to-be-treated area of the substrate, to increase an evaporation rate of the first portion of the organic material solution, whereby, reducing a thickness difference, due to different evaporation rates of the first portion of the organic material solution and a second portion of the organic material solution of the organic material solution layer that is outside the to-be-treated area of the substrate, of the organic layer that is cured from the organic material solution layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.