Diaphragm structure and method of manufacturing the same
US11115767B2 · kind B2 · utility
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1References
13Claims
0Family size
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Key dates
| Filing date | Nov 9, 2018 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Mar 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2307/027
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A diaphragm structure is used for an audio signal output device. The diaphragm structure includes a film substrate, a polymer fiber structure and a thin film metallic glass. The film substrate includes a first surface and a second surface opposite to the first surface. The polymer fiber structure is combined with the first surface of the film substrate. The thin film metallic glass is formed on at least a part of the second surface of the film substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.