Patent · US Active

Component carrier comprising dielectric structures with different physical properties

US11116075B2 · kind B2 · utility

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17Claims

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Assignee

AT&S(China) Co. Ltd. · CN

Inventors

Kim Liu · Kunshan, CN
Nick Xin · Shanghai, CN
Howard Li · Shanghai, CN
Henry Guo · Suqian, CN

Key dates

Filing date	Jan 29, 2020
Grant date	Sep 7, 2021
Priority date	—
Expiry date	Jan 29, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/09136
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A component carrier with a stack having at least one electrically conductive layer structure and a plurality of electrically insulating layer structures and a component embedded in the stack. The plurality of electrically insulating layer structures include a first dielectric structure and a second dielectric structure differing concerning at least one physical property.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.