Laser machining device and laser machining method
US11117221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2017 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Jul 23, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser machining device includes a laser machining head and a control unit. The laser machining head applies laser for machining an object to be machined, and includes a first laser light source for first laser, a second laser light source for second laser having a different pulse width different from the first laser, a condensing optical system provided between the object and the laser light sources to condense at least the lasers on the object, a switch mechanism provided between the condensing optical system and the laser light sources so that the switch mechanism is movable to a position that at least one of the lasers enters the condensing optical system, and an irradiation angle change mechanism provided between the condensing optical system and the switch mechanism to change an irradiation angle of the first laser. The control unit controls the laser machining head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.