Mold clamping device
US11117300B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2020 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Mar 20, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/688
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold clamping device includes a base, a stationary platen fixed to the base and supporting a stationary mold, a movable platen movable on the base and supporting a movable mold, and a mold clamping mechanism for clamping the movable mold against the stationary mold. Tie bars extend from the stationary platen completely through both the movable platen and the mold clamping mechanism. A shaft supporting plate is fixed to the ends of the tie bars and terminates at its lower end portion in two spaced-apart shoes that have flat bottom surfaces in direct sliding contact with the base. The flat bottom surface of each shoe has a larger area than the cross-sectional area of the shaft supporting plate situated vertically above the shoe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.