Embossing tool for deforming smooth and embossed films
US11117342B2 · kind B2 · utility
0Cited by
15References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2017 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | May 26, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB31F2201/0702
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An embossing tool including a female die (5) and a male die (7). A raised section (9) is formed on the female die, which corresponds to the area to be embossed. An elastic compensating element (13) is located in a recess (11) of the male die (7), which protrudes from the surface of the male die (7) by a few tenths of a millimeter. This embossing tool allows the undoing of existing embossments on a film (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.