Laminate for manufacturing flexible substrate and method for manufacturing flexible substrate by using same
US11118015B2 · kind B2 · utility
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Key dates
| Filing date | Jan 19, 2018 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Jan 19, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D179/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The laminate for manufacturing a flexible substrate according to the present invention is formed by using a polyimide having a high absorbance to a UV laser in an organic sacrificial layer for delaminating a flexible substrate from a carrier substrate. Therefore, it is possible that the laser energy density required in the delaminating process using laser irradiation is reduced and the amount of as generated by the delaminating process is remarkably reduced so that the efficiency of the process, the permeability of the flexible substrate is improved and the reliability of the device is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.