Dense fluoropolymer film
US11118044B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2013 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | May 22, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4911
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention pertains to a process for the manufacture of a dense film. The process includes processing, in a molten phase, a solid composition [composition (C)] comprising;at least one vinylidene fluoride (VDF) fluoropolymer comprising one or more carboxylic acid functional end groups [polymer (F)],at least one poly(alkylene oxide) (PAO) of formula (I): HO—(CH2CHRAO)n—RB (I)wherein RA is a hydrogen atom or a C1-C5 alkyl group, RB is a hydrogen atom or a —CH3 alkyl group and n is an integer comprised between 2000 and 40000, preferably between 4000 and 35000, more preferably between 11500 and 30000, and -optionally, at least one inorganic filler [filler (I)]; thereby providing a dense film having a thickness of from 5 μm to 30 μm.The present invention also pertains to the dense film provided by this process and to the use of the dense film as dense separator in electrochemical devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.