Method for depositing protection film of light-emitting element
US11118266B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2018 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Nov 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/034
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a method for depositing a protection film of a light-emitting element, the method comprising the steps of: depositing a first protection layer on a light-emitting element of a substrate by means of the atomic layer deposition method; and depositing at least one additional protection layer on the first protection layer by means of the plasma-enhanced chemical vapor deposition method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.