Patent · US Active

Implicit method and an algorithm for flexible functionally tailorable slicing for additive manufacturing

US11119466B2 · kind B2 · utility

0Cited by
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20Claims
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Key dates

Filing dateDec 1, 2017
Grant dateSep 14, 2021
Priority date
Expiry dateOct 28, 2038

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG05B2219/49007
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

A method for flexible functionally tailorable slicing for additive manufacturing includes the steps of receiving and parsing an input model of an object to be additively manufactured; reconstructing a domain boundary of the object; computing individual layer boundaries of the object; constructing, for each layer, layer domains from respective enclosing boundaries; computing, for each layer, a perimeter shell and a volumetric infill by finding level sets of a field function selected by a user; collecting and arranging into a coherent sequence each perimeter shell and volumetric infill; and formatting the coherent sequence as motion commands for an additive manufacturing system.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.