Die heat dissipation structure
US11121053B2 · kind B2 · utility
0Cited by
7References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 17, 2020 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Jan 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die heat dissipation structure includes a heat dissipation unit and a die. The heat dissipation unit has a first side and a second side. The second side is formed with a contact section raised from the second side. One end of the contact section has a slightly convex form. The die has an upper surface and a lower surface. One end of the contact section attaches to and is in contact with the upper surface of the die. The upper surface has a slightly concave form in adaptation to the slightly convex form of the contact section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.