Power module and method for manufacturing power module
US11121059B2 · kind B2 · utility
4Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2018 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | May 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention concerns a power module composed of a first and second parts (100a, 100b), the first part being composed of conductor layers and insulation layers, characterized in that a first conductor layer is on bottom of the first part, the second part is composed of at least one second conductor layer, the first and/or the second conductor layers comprise cavities that form pipes (300a, 300b) when the first and second conductor layers are in contact, and in that the first and the second conductor layers are bonded together by a metal plating (400a, 400g) of the walls of the pipes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.