Array substrate, display device, method for manufacturing them, and spliced display device
US11121068B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2019 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Nov 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/15
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure provide an array substrate, a display device, a method for manufacturing an array substrate, a method for manufacturing a display device, and a spliced display device. The array substrate includes: a base substrate in which a through hole is provided; a filling portion disposed in the through hole, including a recessed structure and made from a flexible material; an electrically conductive pattern disposed on the filling portion and at least partially located in the recessed structure; and a film layer disposed on a side of the electrically conductive pattern facing away from the base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.