Semiconductor devices with shield
US11121094B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2019 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Jun 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.