Light-emitting diode packages with individually controllable light-emitting diode chips
US11121298B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2018 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Aug 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Solid-state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs that include individually controllable LED chips are disclosed. In some embodiments, an LED package includes electrical connections configured to reduce corrosion of metals within the package; or decrease the overall forward voltage of the LED package; or provide an electrical path for electrostatic discharge (ESD) chips. In some embodiments, an LED package includes an array of LED chips, each of which is individually controllable such that individual LED chips or subgroups of LED chips may be selectively activated or deactivated. A single wavelength conversion element may be provided over the array of LED chips, or separate wavelength conversion elements may be provided over one or more individual LED chips of the array. Representative LED packages may be beneficial for applications where a high luminous intensity with a controllable brightness or adaptable emission pattern is desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.