Circuit board separation mechanism
US11121504B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2020 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Feb 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board separation mechanism may include a separation block positioned within a separation block cut-out of a heatsink. The heatsink may be positioned between a first circuit board including a first component of at least one connector and a second circuit board including a second component of the at least one connector. The circuit board separation mechanism may include a set screw inserted in the separation block. A portion of the set screw may be configured to engage a surface of the heatsink. The separation block may be configured to lift against a surface of the first circuit board when the set screw is rotated. The first component of the at least one connector and the second component of the at least one connector may be configured to separate when the set screw is rotated and the separation block lifts against the surface of the first circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.