Contact pad features
US11121647B2 · kind B2 · utility
1Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2019 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Dec 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/875
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical connection structure for connecting a piezoelectric element and an electrical circuit to each other with a conductive adhesive is described. The electrical connection structure includes an epoxy, a conductive component surrounded by the epoxy, and a trace feature implemented on top of the electrical connection structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.