Method for forming laminated circuit board
US11122693B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2017 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Nov 28, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Described are processes for developing laminated circuit boards, as well as the resulting circuit boards themselves. Accordingly, at least two circuit boards at least partially overlap each other, and at least one through-hole is formed in an overlapping region thereof. The through-hole is filled with an electrically-conductive material, forming a through-via that enables the circuit boards to be electrically connected. When a circuit on each circuit board is laid out so that a part thereof reaches a region in which the through-via is to be formed, then that part of the circuit can be electrically connected to the through-via. Thus, portions of the circuits on the circuit boards can be electrically connected to each other via common through-vias to realize an integrated device in which the circuits on the laminated circuit boards function.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.