Heat transfer apparatus
US11122706B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 14, 2019 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Sep 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20318
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer apparatus and method of manufacture is disclosed. The manifold may have a first mechanical interface, a second mechanical interface remote from the first mechanical interface and one or more internal walls defining at least first and second channels within the manifold between the first and second mechanical interfaces. An evaporator member may be attached to the manifold so as to seal the first mechanical interface. A condenser member may be attached to the manifold so as to seal the second mechanical interface. The manifold, evaporator and condenser members may provide a contained heat transfer system in which a working fluid moves between the condenser member and the evaporator member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.