Heat dissipation structure for electronic device and electronic device
US11122710B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2020 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Jul 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.