Hot stamping die apparatus
US11123783B2 · kind B2 · utility
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3Claims
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Key dates
| Filing date | Nov 21, 2018 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Jul 26, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21D37/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a hot stamping die apparatus including sub-assemblies constructed by making a plurality of plates erect and sequentially overlapping the plurality of plates in a face-to-face manner. A first cooling channel extending along overlapping surfaces is provided by forming grooves corresponding to each other on overlapping surfaces of adjacent plates, A second cooling channel passing through the corresponding sub-assembly in the length direction is provided in at least one of the sub-assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.