Manufacturing method for glass substrate, method for forming hole in glass substrate, and apparatus for forming hole in glass substrate
US11123822B2 · kind B2 · utility
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8References
19Claims
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Key dates
| Filing date | Mar 29, 2017 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Jun 8, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A manufacturing method for a glass substrate having a hole with a depth of d (μm) or more includes irradiating the glass substrate with a laser beam emitted from a CO2 laser oscillator for an irradiation time t (μsec), to form a hole in the glass substrate. The laser beam is delivered to the glass substrate after being condensed at a focusing lens. A power density Pd (W/cm2), defined by Pd=P0/S where P0 and S are a power and a beam cross-sectional area of the laser beam just prior to entering the focusing lens, respectively, is 600 W/cm2 or less. The irradiation time t (μsec) satisfies t≥10×d/(Pd)1/2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.