Heat sealed packaging assemblies and methods of producing and using the same
US11124348B2 · kind B2 · utility
3Cited by
186References
6Claims
0Family size
Inventors
Key dates
| Filing date | Sep 15, 2017 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Jul 13, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D5/5028
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A packaging device can include a resilient member formed of one or more layers of different materials and a frame member. The resilient member can be heat sealed to the frame member or to a coating on the surface of the frame member. The layers can be made from different materials or the same materials having different thicknesses, modules of elasticity, melting index, or other different characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.