Reactive hot melt adhesive composition
US11124683B2 · kind B2 · utility
0Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2019 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Jul 9, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2170/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a process for preparing a reactive hotmelt adhesive formulation having a low residual content of monomeric diisocyanate. The present invention further provides a reactive hotmelt adhesive composition obtainable by the process of the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.