Board and method for manufacturing a board
US11124973B2 · kind B2 · utility
4Cited by
7References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 26, 2018 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Sep 26, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W30/91
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A board consisting at least of a substrate formed at least of a gypsum-based and/or cement-based basic material layer. The board is provided with a chamfer extending through the basic material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.