Reducing diffraction effects on an ablated surface
US11126056B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2019 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Aug 17, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/57
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for removing a material from a surface of a substrate includes impinging a laser beam on the material during a first sweep to remove the material from the surface along a first line and impinging the laser beam on the material during a second sweep to remove the material from the surface along a second line adjacent to the first line. The first line includes first artifacts that form a first portion of an array of artifacts on the surface. The second line includes second artifacts that form a second portion of the array of artifacts on the surface. A first laser pulse of the laser beam corresponding with the second sweep is synchronized with a start of the second sweep when transitioning between the first line and the second line such that the start of the second sweep coincides with the first laser pulse.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.