Patent · US Active

Ultrasonic fingerprint sensor with flexible substrate

US11126814B2 · kind B2 · utility

1Cited by

5References

13Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Yipeng Lu · Davis, US
Hrishikesh Vijaykumar Panchawagh · Rochester, US
Kostadin Dimitrov Djordjev · Los Gatos, US
Jae Hyeong Seo · Pleasanton, US
Nicholas Ian Buchan · San Jose, US
Chin-Jen Tseng · Fremont, US
Tsongming Kao · Sunnyvale, US

Key dates

Filing date	Jul 29, 2019
Grant date	Sep 21, 2021
Priority date	—
Expiry date	Nov 25, 2039

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

An ultrasonic fingerprint sensor system of the present disclosure may be provided with a flexible substrate. The ultrasonic fingerprint sensor system may include a film stack disposed on the flexible substrate that provides acceptable acoustic coupling for fingerprint sensing. The ultrasonic fingerprint sensor system includes a high acoustic impedance layer in an acoustic path of ultrasonic waves through a display. The high acoustic impedance layer can be electrically conductive or electrically nonconductive. In some implementations, the ultrasonic fingerprint sensor system includes an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.