Semiconductor device and display including wiring line having protective metal film
US11127762B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2019 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Mar 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D99/00
Abstract
A semiconductor device includes a semiconductor film, a semiconductor auxiliary film, a wiring line, a first metal film, and an interlayer insulating film. The semiconductor film includes a channel region and a low-resistance region. The semiconductor film includes indium and oxygen. The semiconductor auxiliary film is in contact with the low-resistance region of the semiconductor film and reduces the electric resistance of the semiconductor film. The wiring line is electrically coupled to the low-resistance region of the semiconductor film. The first metal film covers the wiring line and has a higher standard electrode potential than the indium. The interlayer insulating film covers the semiconductor film with the first metal film interposed therebetween. The interlayer insulating film has a first hole and a second hole. The first hole is provided at a position opposed to the low-resistance region of the semiconductor film. The second hole reaches the first metal film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.