Electronic device comprising a chip provided with an optical sensor
US11127874B2 · kind B2 · utility
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0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2019 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Oct 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/167
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device, comprising: a support plate having a rear face and a front face; an electronic integrated circuit chip having a rear face mounted on the front face of the support plate and including an optical component in a front face; and a sleeve forming a traversing passage and having a rear edge and a front edge at the opposite ends of the traversing passage, the rear edge being mounted on the front face of the chip, in such a position that the optical component of the chip is facing the traversing passage of the sleeve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.